Wafer Grinder/Lapping Machine
DXSG320
Application Example(s): Wafers
Industry: Information Technology/Semiconductor
Grinding Capacity/Lapping capacity: Ø200 – Ø300mm
Description: Simultaneously grinding both faces of Silicon Wafers with a throughput of 90 seconds for 300mm diameter wafers.
R631DF
Application Example(s): Wafers
Industry: Information Technology/Semiconductor
Grinding Capacity/Lapping capacity: Ø200mm
Description: Special grinder for hard but brittle wafers. High-precision grinder to replace lapping machines. Fully automated cassette to cassette operation. Grinding parameters of each wafer can be stored.